Demo at DesignCon 2024 Highlights Spectra7's GC1122 Chips Embedded in ACES OSFP High Speed Cable Assemblies

SAN JOSE, Calif., Feb. 7, 2024 /CNW/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and ACES Electronics Co., Ltd ("ACES"), a leading Taiwan-based connector and cable supplier, announced that they successfully demonstrated best-in-class performance of 800G Active Copper Cables (ACC's) at this year's annual DesignCon Conference Exhibition held last week in Santa Clara, California.

(PRNewsfoto/Spectra7 Microsystems Inc.)

In the demonstration, ACES 800Gbps OSFP ACCs with Spectra7's embedded GC1122 chips successfully interoperated with test equipment from several vendors to produce very robust low pre-FEC bit error rates (BERs) significantly below standard required BER.

"We are extremely proud to be working with ACES to broaden access to our 800G ACC solutions using Spectra7's innovative GaugeChanger™ integrated chips," said Spectra7 CEO Raouf Halim. "We are delighted to have showcased our technology with them at DesignCon 2024. "

Spectra7's analog based GaugeChanger™ GC1122 chips are used in ACCs and offer significant cost, size, latency and energy consumption value versus competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies.

ABOUT ACES

ACES is a world leader in high precision electrical and electronic connectors, electro-mechanical assemblies, and specialty cable products in diversified industries, including notebooks, peripherals for consumer electronics, handheld mobile communication devices, automobiles electronics, cloud servers, and industrial control. Products include precision connectors, micro coaxial cables, electronic cables, USB/IO connectors and cables, Type C connectors and cables, power connectors, card edge connectors, high-power connectors, high-speed connectors and cables, automobile electronic connectors and cables, wireless RF connectors and cables, stamping parts and other components. ACES designs, manufactures and assembles its products at research and development and manufacturing facilities in Taiwan, China, the Philippines, Vietnam, Japan and the USA.

For more information, please visit http://www.acesconn.com/

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with a design center in Cork, Ireland and a technical support location in Dongguan, China. For more information, please visit www.spectra7.com. 

Neither the TSX Venture Exchange nor its regulation services provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

CAUTIONARY NOTES

Certain statements contained in this press release constitute "forward-looking statements". All statements other than statements of historical fact contained in this press release, including, without limitation, the Company's strategy, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words "believe", "expect", "aim", "intend", "plan", "continue", "will", "may", "would", "anticipate", "estimate", "forecast", "predict", "project", "seek", "should" or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company's expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to, the risk factors discussed in the Company's management's discussion and analysis for the year ended December 31, 2022. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.

For more information, please contact:

Matt Kreps
Darrow Associates
214-597-8200
ir@spectra7.com

Spectra7 Microsystems Inc.
Dave Mier
Interim Chief Financial Officer
925-858-7011
ir@spectra7.com

Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com 

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SOURCE Spectra7 Microsystems Inc.

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