ASM INTERNATIONAL N.V. LAUNCHES TENZATM ALD FOR SILICON OXIDE GAP-FILL AND LINERS
13 Luglio 2022 - 05:45PM
ASM INTERNATIONAL N.V. LAUNCHES TENZATM ALD FOR SILICON OXIDE
GAP-FILL AND LINERS
Almere, The NetherlandsJuly 13, 2022, 5.45 p.m.
CET
New process technology addresses 300mm
advanced memory and logic/foundry applications with best film
quality, highest productivity and lowest cost of ownership in its
class.
San Francisco, USA – ASM International
N.V. (Euronext Amsterdam: ASM) today announced TENZATM ALD, an
innovative single wafer atomic layer deposition (ALD) process
technology for 300mm wafers. TENZATM ALD is optimized for gap-fill
applications and provides the best film quality, conformal coverage
through the full trench and highest productivity in its
class.
TENZATM ALD is offered on ASM’s high
productivity quad chamber module (QCM) architecture, with four
tightly integrated reactors on each QCM. In a compact
configuration, up to 4 QCMs running the TENZATM ALD process can be
attached to the XP8 platform, enabling processing of up to 16
wafers at a time.
“TENZATM ALD leverages ASM’s production proven
QCM quad chamber module architecture and XP8® platform, which have
been in high volume manufacturing fabs for several years, to bring
enhanced process capability at the lowest cost of ownership to the
market. TENZATM ALD enables ultra-high aspect ratio (>100:1)
gap-fill for advanced memory devices”, said Hichem M’Saad, Chief
Technology Officer and Member of the Management Board.
TENZATM ALD utilizes a novel design optimized
for ALD reactions, minimizing process volume for maximum precursor
utilization efficiency, reducing precursor consumption up to 50%
and increasing productivity more than double compared to
conventional ALD approaches. Each reactor chamber controls the RF
plasma power supply and matching system individually to improve
process reproducibility. The small volume reactor also provides
excellent defect performance and extended reactor life (run time
before preventive maintenance). Process reactions are confined
within each small volume reactor space to minimize consumable
parts, making maintenance very easy and less costly.
TENZATM ALD enables a variety of silicon oxide
applications for gap-fill and liners for a range of structures in
advanced transistors, memory devices and interconnects. The
industry can count on TENZATM ALD to deliver a high quality,
reliable, repeatable, production proven gap-fill process with the
lowest cost of ownership on the market today.
Deliveries of TENZATM ALD have begun to multiple
global customers, among them leaders in memory device
manufacturing. ASM’s mature compact ALD quad chamber module
architecture has a proven track record with more than 2,000
reactors shipped to customers.
About ASM International
ASM International N.V., headquartered in Almere,
the Netherlands, and its subsidiaries design and manufacture
equipment and process solutions to produce semiconductor devices
for wafer processing, and have facilities in the United States,
Europe, and Asia. ASM International's common stock trades on the
Euronext Amsterdam Stock Exchange (symbol: ASM). For more
information, visit ASMI's website at www.asm.com.
Cautionary Note Regarding Forward-Looking
Statements: All matters discussed in this press release, except for
any historical data, are forward-looking statements.
Forward-looking statements involve risks and uncertainties that
could cause actual results to differ materially from those in the
forward-looking statements. These include, but are not limited to,
economic conditions and trends in the semiconductor industry
generally and the timing of the industry cycles specifically,
currency fluctuations, corporate transactions, financing and
liquidity matters, the success of restructurings, the timing of
significant orders, market acceptance of new products, competitive
factors, litigation involving intellectual property, shareholders
or other issues, commercial and economic disruption due to natural
disasters, terrorist activity, armed conflict or political
instability, changes in import/export regulations, epidemics and
other risks indicated in the Company's reports and financial
statements. The Company assumes no obligation nor intends to update
or revise any forward-looking statements to reflect future
developments or circumstances.
This press release contains inside information
within the meaning of Article 7(1) of the EU Market Abuse
Regulation. CONTACT
Investor and media contact:Victor BareñoT: +31 88 100
8500 E: investor.relations@asm.com
- 20220713 - ASMI launches TENZA ALD for silicon oxide gap-fill
and liners
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