Toshiba Memory Corporation to Further Invest in Production Equipment for Fab 6 at Yokkaichi Operations
11 Ottobre 2017 - 09:00AM
Business Wire
Toshiba Corporation (TOKYO:6502) today announced that its board
of directors has approved a further investment by Toshiba Memory
Corporation (TMC), a wholly-owned subsidiary that manufactures
Flash memory, in manufacturing equipment for the Fab 6 clean room
under construction at Yokkaichi Operations. TMC will invest
approximately 110 billion yen as a second investment in Fab 6 for
the installation of additional manufacturing equipment in the
Phase-1 clean room.
Production at Fab 6 will be entirely devoted to BiCS FLASH™,
Toshiba's innovative 3D Flash memory. As Toshiba announced in its
August 3, 2017 release “Update on Toshiba Memory Corporation’s
Investment in Production Equipment for Fab 6 at Yokkaichi
Operations”, TMC has previously invested approximately 195 billion
yen in Fab 6 as its first investment covering the installation of
manufacturing equipment in the Phase-1 clean room and the
construction of the Phase-2 clean room.
Demand for TMC’s next generation 3D Flash memory devices is
expected to increase significantly due to growing demand for
enterprise SSDs in datacenters, SSDs for PCs, and memory for
smartphones; TMC expects this strong market growth to continue in
2018. TMC’s investment timing will position it to capture this
growth and expand its business.
The investment in Fab 6 will enable TMC to install manufacturing
equipment for 96-layer 3D Flash memories, including deposition and
etching equipment.There is no change in the FY2017 Financial
Forecast announced on Aug 10, 2017, as the impact of the additional
investment will be realized after FY2018. However, the FY2017
investment plan for Toshiba Corporation Storage & Devices
Solutions Segment will be revised from 330 billion yen, as
announced on August 10, to 400 billion yen by accelerating a part
of the investment previously planned for FY2018. This will be used
with the remaining 40 billion yen in the FY2017 investment plan,
bringing this second investment to 110 billion yen. As announced on
March 17, 2016 announcement “Notice of Construction of New
Semiconductor Fabrication Facility,” Toshiba decided on a
construction and equipment investment plan for the new fabrication
facility, with an estimated cost of approximately 360 billion yen
from FY2016 to FY2018. The company will update its investments
plans to reflect any subsequent changes.
TMC has recently asked SanDisk, its collaborator in three joint
ventures for investment in manufacturing equipment at TMC’s
Yokkaichi Operations, whether it intends to jointly participate in
this second investment for the Phase-1 clean room in the Fab 6
facility.
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Media ContactToshiba CorporationKaori Hiraki,
+81-3-3457-2100Public Relations & Investor Relations
Divisionmedia.relations@toshiba.co.jpFax: +81-3-5444-9202