- New DSPs offer scalable architecture and dual thread design
with support for AI, addressing growing demand for smarter, more
efficient wireless infrastructure
- High-performance Ceva-XC23 DSP delivers 2.4X improvements
in performance and area efficiency for more intensive
applications
- Ceva-XC21 targets cost-sensitive applications delivering up
to 1.8X performance and efficiency improvements and requiring up to
48% less area
ROCKVILLE, Md., Feb. 27,
2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the
leading licensor of silicon and software IP that enables Smart Edge
devices to connect, sense and infer data more reliably and
efficiently, today launched its latest high-performance, baseband
vector DSPs targeting advanced 5G and 6G-ready applications.
Built on the successful Ceva-XC20 architecture, already in design
with two Tier-1 infrastructure OEMs for 5G-advanced and pre-6G
processors, these new DSPs enable faster, more efficient data
processing while reducing latency and increasing throughput. Both
new DSPs come with AI support, allowing customers to apply Machine
Learning to optimize modem algorithm performance and network
efficiency for UE and infrastructure and future-proof their designs
for evolving wireless standards.
The Ceva-XC21 5G IoT DSP is designed for low-power, cost- and
size-optimized cellular IoT modems, NTN VSAT terminals, eMBB and
uRLLC applications. As the successor to the widely-adopted
Ceva-XC4500 DSP, the Ceva-XC21 offers a size reduction of up to 48%
compared to the Ceva-XC4500, and delivers the same performance at
63% of the area.
The Ceva-XC23 DSP targets regenerative NTN satellite payloads,
high-end user equipment (UEs) and infrastructure baseband
processing, including baseband units (BBUs), distributed units
(DUs) and radio units (RUs). It provides high-performance
capabilities for 5G-advanced and pre-6G applications with
performance boost of up to 2.4 times and a 2.3X efficiency
improvement compared to the Ceva-XC4500.
"Our latest vector DSPs represent a significant leap forward in
performance and efficiency for advanced 5G and 6G applications.
Building on the success of our industry-leading Ceva-XC4500, which
has powered hundreds of millions of devices, these new DSPs offer a
robust, future-proof platform to develop highly efficient
next-generation modems and infrastructure ASICs. With AI
support and programmability, these DSPs not only improve modem
performance but also enable advanced AI and ML workloads, ensuring
optimal network performance and efficiency towards 6G," said
Guy Keshet, vice president and
general manager, Mobile Broadband Business Unit at Ceva.
The Ceva-XC21 and Ceva-XC23 DSPs are built on top of the
scalable, multi-thread Ceva-XC20 architecture, offering optimized
cost-power-performance for their respective end markets.
Key features include:
- Ceva-XC21: 256b SIMD vector size,
single/dual thread options, and 64/32 16x16-bit MAC options
- Ceva-XC23: 512b SIMD vector size,
dual thread design, and 128 16x16-bit MACs for demanding
applications
Both DSPs feature:
- 5th generation Ceva-XC Communication Vector DSP Architecture
- AI support for 8-bit neural networks
- Dual threading with Dynamic Vector Threading (DVT)
- Enhanced 5G ISA for accelerated 5G channel processing
The Ceva-XC21 and Ceva-XC23 DSPs ensure seamless migration for
existing Ceva-XC customers, with code compatibility with other
Ceva-XC20 products and ISA compatibility with
the popular Ceva-XC4500.
For more information, visit
https://www.ceva-ip.com/product/ceva-xc21/ and
https://www.ceva-ip.com/product/ceva-xc23/.
Availability:
The Ceva-XC21 and Ceva-XC23 will be
available for general licensing by the end of the first
quarter.
About Ceva, Inc.
At Ceva, we are passionate about
bringing new levels of innovation to the smart edge. Our wireless
communications, sensing and Edge AI technologies are at the heart
of some of today's most advanced smart edge products. From wireless
connectivity IPs (Bluetooth, Wi-Fi, UWB and 5G platform IP),
to scalable Edge AI NPU IPs and
sensor fusion solutions, we have the broadest portfolio of IP to
connect, sense and infer data more reliably and efficiently. We
deliver differentiated solutions that combine outstanding
performance at ultra-low power within a very small silicon
footprint. Our goal is simple – to deliver the silicon and software
IP to enable a smarter, safer, and more interconnected world. This
philosophy is in practice today, with Ceva powering more than 19
billion of the world's most innovative smart edge products from
AI-infused smartwatches, IoT devices and wearables to autonomous
vehicles and 5G mobile networks.
Our headquarters are in Rockville,
Maryland with a global customer base supported by operations
worldwide. Our employees are among the leading experts in their
areas of specialty, consistently solving the most complex design
challenges, enabling our customers to bring innovative smart edge
products to market.
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X,
YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.
