Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles
10 Aprile 2024 - 8:00AM
Embedded World -- Micron Technology, Inc. (Nasdaq: MU), today
announced that it has qualified a full suite of its
automotive-grade memory and storage solutions for Qualcomm
Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive
set of cloud-connected platforms designed to power data-rich,
intelligent automotive services. Micron’s low-power double data
rate 5X (LPDDR5X) memory, Universal Flash Storage (UFS) 3.1,
Xccela™ flash memory and quad serial peripheral interface NOR
(SPI-NOR) flash have been pre-integrated for the latest generation
of Snapdragon automotive solutions and modules, including the
Snapdragon® Cockpit Platform, Snapdragon Ride™ Platform and
Snapdragon Ride™ Flex System-on-Chip (SoC), all of which are
intended to handle the increasing requirements of modern and future
workloads for artificial intelligence (AI) technologies. This work
between Micron and Qualcomm Technologies is aimed at helping the
ecosystem build next-generation intelligent vehicles powered by
sophisticated AI.
“Today’s software-defined vehicles and immersive cockpits
require highly reliable, ultralow-latency memory and storage to
process massive amounts of data at the edge and enable
time-critical near-instant decision-making,” said Chris Jacobs,
vice president of Micron’s embedded market segments. “Our broad
portfolio of automotive memory and storage solutions provides the
instant-on performance required on the road, and we’re thrilled to
work with Qualcomm Technologies to accelerate ecosystem adoption of
the leading-edge solutions designed to make vehicles safer and
smarter.”
Micron offers a wide portfolio of automotive-grade solutions
with high reliability, fast boot times, high bandwidth, low power
and a small footprint. Unlike many automotive-marketed solutions
that are built for consumer devices, Micron’s automotive-grade
products are uniquely ruggedized, built and optimized to meet
demanding automotive standards through its process technology and
product development. These automotive products are rigorously
tested to provide the extreme stability, quality, thermal
tolerances, reliability and longevity that the automotive market
requires.
Micron’s solutions are qualified for a range of Snapdragon
Digital Chassis solutions that support a range of AI-driven
features:
- Snapdragon Cockpit Platform is
designed for software-rich, personalized digital cockpits,
supporting immersive audio, intelligent driving assistance and rich
visual experiences across multiple displays. Equipped with
high-performance computing and machine learning accelerators, the
Snapdragon Cockpit Platform features multimodal generative AI
capabilities and enables the development of digital cockpits that
can intuitively adapt and evolve with driver needs and
technological advancements.
- Snapdragon Ride Platform enables
advanced driver-assistance systems (ADAS) features and supports a
range of functionalities from basic parking assistance to higher
levels of autonomy and technologies such as computer vision,
complex AI networks, camera visualization, sensor fusion, lidar
perception, automated driving maps and ultrasonic sensor
processing.
- Snapdragon Ride™ Flex SoC is
designed to support mixed-criticality workloads with central
compute, integrating digital cockpit, ADAS and automated driving
capabilities on a single chip. This centralization helps automakers
achieve a unified software-defined vehicle architecture, paving the
way for multimodal AI networks in automotive systems.
Micron’s automotive solutions will deliver powerful benefits for
Qualcomm Technologies’ automotive customers and the broader
ecosystem:
- Micron’s automotive LPDDR5X is the flagship
memory solution for applications needing the fastest speeds and
lowest power profile. LPDDR5X enables improved energy efficiency
and performance for intelligent vehicles with increasingly
bandwidth- and energy-hungry technologies such as AI-based
autonomous driving features. Notably, Micron’s LPDDR5X is
backward-compatible for LPDDR5 speeds of 6.4 gigabits per second,
which Qualcomm Technologies has qualified the memory for. With this
qualification, Qualcomm Technologies’ latest generation Snapdragon
automotive SoCs are the first SoC family enabling the LPDDR5
interface.
- Micron’s automotive UFS 3.1 storage enables
two times faster read performance and a 50% improvement in
sustained write performance,1 enabling faster startups and
over-the-air updates, more responsive launching of applications and
an overall smoother user experience. This boost in speed
brings the driver experience in line with the expectations of
consumers who have little tolerance for latency while on the road,
especially when accessing critical data such as directions from
their digital cockpit.
- Micron’s Xccela™ flash memory is one of the
industry’s highest-performance NOR flash memories, delivering five
times the performance and reducing energy consumption by three
times.2 This capability enables instant-on performance and fast
system responsiveness in automotive applications.
- Quad SPI-NOR flash delivers fast code
execution and high reliability for applications such as boot code
and program code. This is especially critical for scenarios such as
reliably booting up a vehicle’s digital cockpit and operating
system as soon as a driver starts the engine, as code failure may
result in cars being “bricked” or rendered inoperable.
These Micron solutions have been enabled in all the volatile and
nonvolatile memory sockets of the latest generation Snapdragon
Cockpit Platforms. The companies’ work builds on a long-standing
working relationship that spans multiple generations of platforms
between Micron and Qualcomm Technologies to bring immersive
in-vehicle experiences to cars. With this qualification, Micron and
Qualcomm Technologies together help the ecosystem build
next-generation intelligent vehicles powered by sophisticated
AI.
Used by leading automakers, Micron’s automotive solutions have
accumulated trillions of miles on the road3 over the company’s
nearly 35 years in the automotive market. Micron’s deep
expertise stems from tight collaboration with automotive customers
on designing memory into evolving architectures underpinning
cutting-edge automotive technologies.
This announcement complements Micron’s unveiling of the Micron
4150AT SSD at Embedded World in Germany this week. Offering
first-of-its-kind virtualization, and four customizable ports, the
automotive-grade drive enables a new paradigm of centralized
architectures for intelligent vehicles. Together, these launches
extend Micron’s automotive leadership and better empower the
automotive ecosystem to usher vehicles into a new era of
intelligence at the edge.
Resources
- Portfolio page: Automotive memory and storage solutions
Snapdragon, Digital Chassis, and Snapdragon Ride are trademarks
or registered trademarks of Qualcomm Incorporated.Snapdragon,
Snapdragon Digital Chassis, Snapdragon Ride, and Snapdragon Ride
Flex are products of Qualcomm Technologies, Inc. and/or its
subsidiaries.
About Micron Technology, Inc. We are an
industry leader in innovative memory and storage solutions
transforming how the world uses information to enrich life for all.
With a relentless focus on our customers, technology leadership,
and manufacturing and operational excellence, Micron delivers a
rich portfolio of high-performance DRAM, NAND and NOR memory and
storage products through our Micron® and Crucial® brands. Every
day, the innovations that our people create fuel the data economy,
enabling advances in artificial intelligence and 5G applications
that unleash opportunities — from the data center to the
intelligent edge and across the client and mobile user experience.
To learn more about Micron Technology, Inc. (Nasdaq: MU), visit
micron.com.
© 2024 Micron Technology, Inc. All rights reserved. Information,
products, and/or specifications are subject to change without
notice. Micron, the Micron logo, and all other Micron trademarks
are the property of Micron Technology, Inc. All other trademarks
are the property of their respective owners.
1 Over prior-generation UFS 2.1 devices2 Compared to the page
mode parallel NOR solution 3 Based on Micron’s
calculations
Micron Media Relations Contact
Steffi Lau
Micron Technology, Inc.
+1 (408) 834-1618
steffilau@micron.com
Micron Investor Relations Contact
Satya Kumar
Micron Technology, Inc.
+1 (408) 450-6199
satyakumar@micron.com
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