Aehr Test Systems to Participate in 15th Annual CEO Investor Summit 2023 in San Francisco
22 Giugno 2023 - 1:30PM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and production
burn-in equipment, today announced that management is
scheduled to participate in the 15th Annual CEO Investor Summit
2023 being held Wednesday, July 12th at the St. Regis Hotel, San
Francisco, CA.
“We once again look forward to participating in
this annual event and discussing our unique semiconductor
production test and burn-in solutions and the markets
they serve with investors and shareholders,” said Gayn
Erickson, President and CEO of Aehr Test Systems. “We continue
to be very excited about the market opportunity for our wafer level
test and burn-in of silicon carbide devices used in electric
vehicles and electric vehicle charging infrastructure. We are also
seeing increasing interest for our products for the impending
market for gallium nitride devices used in photovoltaic/solar power
conversion infrastructure and automotive applications. Aehr
Test provides complete production solutions for improving quality,
reliability, and yield of semiconductors such as silicon carbide
devices used in electric vehicles and charging infrastructure,
silicon photonics devices used in data centers and 5G
infrastructure and also for new applications such as optical
input/output (I/O) and co-packaged optics devices that are on the
horizon. Wafer level test and burn-in of these and other devices
used in applications where quality, reliability, safety, and
security are critical to the customers and the semiconductor
suppliers who supply to them are significant drivers for Aehr Test
revenue and profitability this fiscal year and through the end of
the decade or longer.”
The presentation material utilized at the CEO
Summit will be made available on the investor relations page of the
Company’s website at www.aehr.com.
About the 15th Annual CEO Investor Summit
2023The CEO Investor Summit is collectively hosted and
funded by participating companies and features a “round-robin”
format consisting of small group meetings with company management
teams. During the event, investors and analysts will have the
opportunity to meet with the majority of the 13 management teams
during the small group meeting sessions, as well as opportunities
to meet with management during the breakfast and lunch networking
sessions.
Attendance at the CEO Investor Summit is by
invitation only and is available solely to accredited investors and
publishing research analysts. As space is limited, please RSVP
early. Hosts reserve the right to limit attendance as necessary.
Last day for registration is June 30, 2023.
RSVP Contacts for 15th Annual CEO Investor
Summit 2023To RSVP for the CEO Investor Summit, please
contact either of the event co-chairs.
Laura J. Guerrant-Oiye |
|
Claire E. McAdams |
Phone: (808)
960-2642 |
|
Phone: (530)
265-9899 |
Email:
lauraoiye@gmail.com |
|
Email:
claire@headgatepartners.com |
|
|
|
About Aehr Test
SystemsHeadquartered in Fremont, California, Aehr Test
Systems is a worldwide provider of test systems for burning-in
semiconductor devices in wafer level, singulated die, and package
part form, and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and
FOX-P™ families of test and burn-in systems and FOX
WaferPak™ Aligner, FOX WaferPak Contactor, FOX
DiePak® Carrier and FOX DiePak Loader. The ABTS system is used
in production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge silicon carbide-based power semiconductors, memories,
digital signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
Contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Contacts:
Aehr Test Systems |
|
MKR Investor Relations Inc. |
Chris
Siu |
|
Todd Kehrli
or Jim Byers |
Chief
Financial Officer |
|
Analyst/Investor Contact |
csiu@aehr.com |
|
(323)
468-2300 |
|
|
aehr@mkr-group.com |
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