Integration of NVIDIA Modulus AI framework with the Ansys
SeaScape platform will enable engineers to easily build customized
AI solutions that can improve designer productivity and quickly
identify optimal design configurations
/ Key Highlights
- NVIDIA Modulus artificial intelligence (AI) framework will be
integrated into the Ansys SeaScape™ cloud-optimized big data
analytics platform for electronic design automation, which has
demonstrated a speed-up of thermal simulation by over 100x
- The Modulus physics-informed AI techniques strongly complement
Ansys multiphysics simulation engines within SeaScape, including
Ansys power integrity and reliability signoff platforms Ansys
RedHawk-SC™, Ansys Totem-SC™, Ansys PathFinder-SC™, and Ansys
RedHawk-SC Electrothermal™
- The integration will improve product outcomes for applications
including graphics processing units (GPUs), high-performance
computing (HPC) chips, AI chips, smartphone processors, and
advanced analog integrated circuits
PITTSBURGH, Nov. 19,
2024 /PRNewswire/ -- Ansys (NASDAQ:
ANSS) today announced it is integrating the NVIDIA Modulus AI
framework into Ansys semiconductor simulation products to deliver
AI functionality that significantly speeds up design optimization.
This will enable engineers to create customized and generative AI
surrogate models that accelerate design iterations and explore a
larger design space. The technology integration will enhance the
outcome for a wide range of products, including GPUs, HPC chips, AI
chips, smartphone processors, and advanced analog integrated
circuits.
NVIDIA Modulus is a physics-AI framework to train and deploy
models that combine physics-based domain knowledge with simulation
data, allowing users to create customized AI engines tailored to
their needs. As AI gets integrated into computer-aided engineering
workflows, it is important for users to have a seamless and
integrated pipeline that allows data generated by solvers to flow
to AI frameworks used to train models. Integrating NVIDIA Modulus
framework into the Ansys SeaScape platform will enable customers to
use high-fidelity data generated by Ansys tools to train their AI
engines and then use the newly created engine for more robust
design exploration.
For example, designers can train their AI models in the
integrated Modulus framework using their library of completed
designs in Ansys RedHawk-SC. Once the AI is trained, it can be used
to identify optimal designs based on desired specifications — such
as size, power, and performance — in a fraction of the time. Ansys
plans to add Modulus-created AI accelerators to its semiconductor
solutions including RedHawk-SC, Totem-SC, PathFinder-SC, and
RedHawk-SC Electrothermal for faster thermal simulation and easier
power calculation. With this AI-enhanced process, Ansys and NVIDIA
have demonstrated over 100x speed-up for thermal simulations.
"NVIDIA has been collaborating closely with Ansys as both a
partner and a customer for many years," said John Lee, vice president and general manager of
the semiconductor, electronics, and optics business unit at Ansys.
"Ansys' advancements in semiconductor design solutions have been
fueled and enabled by NVIDIA's powerful chips, and the
collaboration continues to bring state-of-the-art EDA tools to our
mutual customers."
"NVIDIA Modulus makes it easy to train and deploy AI models that
are physics-informed and reflect real-world causality," said
Tim Costa, senior director of CAE,
EDA & quantum and HPC at NVIDIA. "The integration with Ansys
simulation products for multiphysics semiconductor design are ideal
applications for Modulus to enhance simulation speed and
efficiently identify the best design solutions."
Visit Ansys at Supercomputing24 in Atlanta, GA November
17-22, 2024 at booth #2741 to learn more.
/ About Ansys
Our Mission: Powering Innovation that Drives Human
Advancement™
When visionary companies need to know how their world-changing
ideas will perform, they close the gap between design and reality
with Ansys simulation. For more than 50 years, Ansys software has
enabled innovators across industries to push boundaries by using
the predictive power of simulation. From sustainable transportation
to advanced semiconductors, from satellite systems to life-saving
medical devices, the next great leaps in human advancement will be
powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–T
/ Contacts
Media
|
Mary Kate
Joyce
|
|
724.820.4368
|
|
marykate.joyce@ansys.com
|
Investors
|
Kelsey DeBriyn
|
|
724.820.3927
|
|
kelsey.debriyn@ansys.com
|
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SOURCE Ansys