SAN JOSE, Calif., March 5, 2019 /PRNewswire/ -- Integrated
Device Technology, Inc. (IDT) (NASDAQ: IDTI) today introduced the
industry's first 53Gb/s and 112Gb/s multi-rate Trans-impedance
Amplifiers (TIAs) for optical transceivers, active optical cables
(AOCs) and On-Board Optics (OBO) applications. The single-channel
and quad-channel TIA chips with the IDT® Clock Data Recovery (CDR),
Laser Drivers for Directly Modulated Lasers (DMLs) and
Electro-Absorption Modulated Lasers (EMLs) provide a total solution
to customers to achieve high performance, low power consumption and
low costs.
Datacenters continue to drive the high speed Ethernet optics
with multiple data rates into advanced PAM4 modulations, thus
leading to various PMD form factors. One way to save costs is to
find a way to make a component that could meet multi-rate
requirements. IDT's newly released PAM4 TIA, with a patented
adaptive design, can meet both 53Gb/s and 112Gb/s bandwidth
requirements. The multi-rate function provides design flexibility
to module designers, reduces development cycles and leads a lean
manufacturing operation.
Key attributes and benefits to 200G/400G Datacenter applications
include:
- Low power consumption for PAM4 linear receivers and COBO optics
in QSFP-DD and OSFP modules, for example, as low as <
150mW/channel
- Excellent flat frequency responses and low group delay with
wide bandwidth (up to 43GHz) and AGC, which optimizes PAM4 systems
for wide dynamic PMD links
- Very low input referred noise density as low as 10pA/√Hz
- Compact die size enabling small optical assembly and On-Board
Optics assembly for better port density
- -40°C to 95°C temperature operation range for 5G wireless
front-haul applications
- I2C interface providing on-chip multiple functions, such as
control, monitor and alarms
"We are very excited with the technical performance of the
53G/ch and 112G/ch TIA, which works very well with our PAM4 DML,
and EML drivers in both data rates," said Dr. Kevin Zhang, director of marketing for datacom
products at IDT. "This new generation of TIAs will very well
satisfy the high performance challenges required for 100GBASE-LR
and 400GBASE LR4 standards and simultaneously consume very low
power and deliver a high sensitivity solution for small form factor
modules."
Production TIAs will be shipped in Q2 2019, which perfectly
matches the deployment of 100GBASE-DR, FR and LR and 400GBASE-DR4,
FR4 and LR4 modules in Data Center applications, as well as the
beginning of the 5G applications.
See IDT at OFC 2019 (booth #2217) on March 5-7, 2019 at the San Diego Convention Center for live
demonstrations of our latest solutions. Visit www.idt.com to
learn more about IDT's optical communications products.
About IDT
Integrated Device Technology, Inc. develops
system-level solutions that optimize its customers' applications.
IDT's market-leading products in RF, high performance timing,
memory interface, real-time interconnect, optical interconnect,
wireless power and smart sensors are among the company's broad
array of complete mixed-signal solutions for the communications,
computing, consumer, automotive and industrial segments.
Headquartered in San Jose, Calif.,
IDT has design, manufacturing, sales facilities and distribution
partners throughout the world. IDT stock is traded on the NASDAQ
Global Select Stock Market® under the symbol "IDTI." Additional
information about IDT can be found at www.IDT.com. Follow IDT
on Facebook, LinkedIn, Twitter,
and YouTube.
© 2019, Integrated Device Technology, Inc. IDT and the IDT
logo are trademarks or registered trademarks of Integrated Device
Technology, Inc., and its worldwide subsidiaries. All other brands,
product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their
respective owners.
Krista Pavlakos
Director, Demand Creation & Communications
Phone: 408-574-6640
E-mail: krista.pavlakos@idt.com
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SOURCE Integrated Device Technology, Inc.