SYDNEY, Aug. 15, 2013 /PRNewswire/ -- Audio Pixels
Holdings Limited (ASX:AKP; OTCQX:ADPXY), a fabless semiconductor
company focused on the development and production of MEMS based
digital speaker chips revealed today that since the beginning of
the new year its intellectual property portfolio has expanded to
include 5 new patent families. The patents granted in various
patent jurisdictions around the world include 2 patent grants for
the Basic architecture and functional principles of its MEMS based
digital speaker; control of volume and tone in digital speakers;
Directivity patterns in direct digital speakers; and in the field
of Packaging of MEMS based digital speakers.
"We are excited to see our patents granted as they acknowledge
Audio Pixels as a true pioneer and innovator in digital speaker
technologies," said Yuval Cohen,
Co-Founder and CTO. Audio Pixels patent portfolio now encompasses
not only the principle architecture and functionality of digital
speakers, but also critical innovations that enable the technology
to be commercially exploited.
He added, "For example, the recent patent granted to us
for Dust Protection covers a very unique innovation in MEMS
packaging that provides the highest levels of protection for the
chip from the environment while still permitting the sound waves
generated inside the chip, to radiate to the environment with near
negligible attenuation." MEMS packaging is considered by
the industry at large to be far more challenging than the packaging
of traditional IC's due to the diversity of requirements associated
with providing the ability for the transducer (or sensor) to be in
touch with the environment, yet protected from it.
Fred Bart Chairman of Audio Pixels
Holdings Limited added: "As true pioneers in the digital speaker
space, we have massive opportunities to safeguard a wide variety of
critical enabling technologies, with global patents, further
enhancing our leadership position in the
marketplace."
About Audio Pixels
Audio Pixels patented technological platform utilizes entirely
new techniques to generate sound waves directly from a digital
audio stream using low cost micro-electromechanical structures
(MEMS). This innovation overcomes many of the limitations found in
conventional loudspeaker subassemblies thus enabling the production
of speaker products that deliver superior sound and electrical
performance all in a semiconductor type package that is remarkably
compatible with existing and emerging OEM requirements and
ambitions for their consumer electronic device designs.
For further information please contact:
Danny Lewin - CEO Audio Pixels Limited
+972-732-324-444
danny@audiopixels.com
SOURCE Audio Pixels Holdings Limited