Dow Corning Electronics Introduces Three New Encapsulants for the Fast-Growing Light-Emitting Diode Market
16 Ottobre 2007 - 1:00PM
PR Newswire (US)
Improved Transparency and Heat Resistance Make New Products Ideally
Suited for Use with High-Brightness LEDs MIDLAND, Mich., Oct. 16
/PRNewswire-FirstCall/ -- Dow Corning Corp. today introduced three
new two-part high refractive index (HRI) silicone encapsulants to
serve the fast-growing light-emitting diode (LED) market. Dow
Corning's new encapsulants offer increased light output, a range of
hardnesses to suit a variety of applications, and superior
resistance to heat, chemical and ultraviolet (UV) light exposure
compared to other LED encapsulants on the market today. Market
research firm Strategies Unlimited expects worldwide LED sales to
grow more than 60% during the next three years, reaching $8 billion
during 2010, as LEDs make steady inroads into the general lighting
market as well as applications in automobiles, cellular phones and
LCD laptop and television back-lighting systems. Silicone
encapsulants are helping to enable the LED market's growth by
improving device performance and durability. Most LEDs are coated
with protective encapsulants to prevent electrical and
environmental damage while increasing light output and minimizing
heat build-up. Encapsulants also can be molded into lenses to
create specific light distribution patterns. Until recently,
encapsulants were commonly made of epoxy and other organic
materials because of their hardness, transparency and low cost.
Silicone encapsulants increasingly are gaining favor, however, as
the electronics industry develops more powerful, high-brightness
LEDs. Silicone encapsulants can withstand much higher LED operating
temperatures than epoxy, and are compatible with lead-free solder
reflow manufacturing processes. Silicone encapsulants also offer
high light transmittance, excellent adhesion to a variety of
materials, low moisture absorption, and availability in a wide
range of hardnesses and viscosities. Dow Corning's new two-part HRI
encapsulants are available in three formulations, each optimized
for different uses and manufacturing processes. DOW CORNING(R)
OE-6665 A and B offers maximum hardness along with low viscosity.
DOW CORNING(R) OE-6630 A and B offers a softer formulation with
similarly low viscosity. DOW CORNING(R) OE-6635 A and B also offers
a softer composition, but with twice the viscosity. All three
products are highly transparent, with a refractive index of 1.53,
compared with 1.4 for other silicone encapsulants on the market.
"These new encapsulants offer significantly more light output than
previous formulations, along with silicone's inherent heat
resistance and durability," said Billy Han, Dow Corning's global
market manager for LED and light management products. "LED
encapsulants are a high-growth opportunity for Dow Corning, and we
are pleased to be assisting the market's growth by developing new
materials with superior thermal properties and stability." About
Dow Corning Dow Corning Corporation (http://www.dowcorning.com/) is
a globally integrated provider of materials, application technology
and services, and is focused on providing innovative technologies
that help its customers to invent the future. For more information
on Dow Corning Electronics, visit
http://www.dowcorning.com/electronics. Dow Corning Corporation is
equally owned by The Dow Chemical Company (NYSE:DOW) and Corning
Incorporated (NYSE:GLW). More than half of Dow Corning
Corporation's sales are outside the United States. DATASOURCE: Dow
Corning Corp. CONTACT: Rhonda Bovin of Dow Corning,
+1-989-496-5489, ; or Agency Contact, Bruce Hokanson of Loomis
Group, +1-360-574-4000, Web site: http://www.dowcorning.com/
http://www.dowcorning.com/electronics
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