New Silicon-Infused Bilayer Photoresist Developed By TOK and Dow Corning Electronics Being Used In IC Memory Production
03 Dicembre 2007 - 4:20PM
PR Newswire (US)
Photoresist Provides Improved Etch Selectivity While Eliminating
Hard Mask Layer For Simpler, More Cost-Effective Processing
MIDLAND, Mich., Dec. 3 /PRNewswire-FirstCall/ -- Tokyo Ohka Kogyo
Co., Ltd. (TOK) and Dow Corning Electronics today announced that
their new, jointly developed bilayer photoresist is being used in
production for the first time by a leading manufacturer of DRAM
chips. The new bilayer photoresist uses a Dow Corning silicon
polymer in the imaging layer to provide better etch selectivity
than other products on the market today. Photoresist is a
light-sensitive material that becomes either soluble or insoluble
after exposure to light, allowing portions to be selectively
removed during subsequent etching processes. Adding Dow Corning's
innovative silicon polymer to TOK's photosensitive materials
enables the use of thinner photoresist layers, which improves
pattern resolution and allows smaller circuit patterns to be
transferred onto target wafers without pattern collapse issues. The
new photoresist provides a more cost-effective lithography solution
by eliminating the hardmask layer and accompanying process steps
required by multilayer photoresist processes. It can be used for
both dry and immersion lithography, an advanced imaging technology
that is gaining market acceptance for the 45nm node and beyond. TOK
has already demonstrated use of the photoresist under immersion
lithography conditions to produce 35nm line/space patterns. "Our
partnership with TOK is paying off as chip makers realize the
advantages of this new silicon-infused photoresist," said Tomonobu
Noguchi, Electronic & Advanced Technologies marketing director
with Dow Corning. "This breakthrough material represents a new
class of photoresist, which is helping to extend the capabilities
of 193nm lithography." Dow Corning and TOK have had a joint
development agreement since 2002 to develop advanced silicon-based
photolithography materials. The collaboration combines TOK's
sophisticated microprocess technologies and photolithography
application expertise with Dow Corning's materials innovation and
manufacturing capabilities. The lithography development work is
being conducted at TOK's R&D facilities in Kanagawa, Japan.
About Tokyo Ohka Kogyo Co., Ltd. (TOK) Tokyo Ohka Kogyo Co., Ltd.
(http://www.tok.co.jp/) supplies an assortment of manufacturing
materials centered around photoresist used in fabricating
semiconductors, flat panel displays, printed wiring boards and
semiconductor packaging, as well as photolithography-related
chemicals. The company also furnishes equipment that is
indispensable for fabricating leading-edge semiconductors,
liquid-crystal-display panels and semiconductor packaging. In
addition, TOK offers photopolymer plates and pre-sensitized plates,
which are widely used in the printing field, as well as high-purity
chemicals for use by the chemistry, electronics, pharmaceuticals,
food products, and textile industries. About Dow Corning Dow
Corning Corporation (http://www.dowcorning.com/) is a globally
integrated provider of materials, application technology and
services, and is focused on providing innovative technologies that
help its customers to invent the future. For more information on
Dow Corning Electronics, visit
http://www.dowcorning.com/electronics. Dow Corning Corporation is
equally owned by The Dow Chemical Company (NYSE:DOW) and Corning
Incorporated (NYSE:GLW). More than half of Dow Corning
Corporation's sales are outside the United States. DATASOURCE: Dow
Corning Electronics CONTACT: Rhonda Bovin of Dow Corning,
+1-989-496-5489, ; Bruce Hokanson of Loomis Group, +1-360-574-4000,
Web site: http://www.dowcorning.com/electronics
http://www.dowcorning.com/ http://www.tok.co.jp/
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