nVent Collaborates with NVIDIA on AI-Ready Liquid Cooling Solutions
18 Novembre 2024 - 8:12PM
Business Wire
nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in
electrical connection and protection solutions, today announced
that it is collaborating with NVIDIA (NYSE:NVDA) to deploy liquid
cooling solutions at scale supporting the NVIDIA GB200 NVL72 and
next-generation platforms.
The collaboration is expected to deliver cutting-edge,
built-to-spec liquid cooling technology to enhance the performance
and energy efficiency of NVIDIA-powered data centers. nVent is a
leader in liquid cooling, providing resilient and sustainable
solutions for the next generation of computing supporting AI
demand.
nVent is contributing to active development programs with
hyperscale and high-performance computing (HPC) customers,
delivering customized liquid cooling solutions that support NVIDIA
NVL36 and NVL72 deployments. nVent worked with NVIDIA to define a
reference architecture that utilizes nVent’s coolant distribution
unit, liquid-to-air heat exchanger and manifold products. This
helps data center designers save time during design and
implementation, while delivering the capability to cool
high-compute-density data centers.
nVent’s world-class engineering hubs, on-site labs and
production facilities have produced liquid cooling technology that
is tested and customized to support NVIDIA platforms, enabling
customers to deploy and scale next-generation AI technology.
“nVent is delivering the future of liquid cooling. We design
customized technologies that manage the operating temperatures of
high-performance chips, driving efficiency, scalability and
sustainability for our customers,” said Eric Osborn, nVent VP and
general manager, data center solutions. “Our solutions enhance
performance and reliability for next-generation technology.”
“Extensive time and sophisticated AI abilities are required to
design and build complex data centers,” said Dion Harris, director
of accelerated computing at NVIDIA. “Through NVIDIA’s collaboration
with innovators such as nVent, customers can take advantage of
enhanced performance and scale, accelerating the next generation of
data center performance for HPC workloads at scale, faster than
ever.”
nVent has also collaborated with NVIDIA to deliver solutions for
the Open Compute Project (OCP) community. OCP brings scale and
velocity to the fast-growing data center industry through
open-source design concepts for data centers. This work will help
meet growing demand for data center solutions by easing supply
chain constraints and improving the reliability of technology
around the globe.
nVent provides standard and custom solutions for the next
generation of computing, supported by its global scale and
capacity. Learn more about nVent's liquid cooling portfolio for AI
deployment at scale here.
About nVent
nVent is a leading global provider of electrical connection and
protection solutions. We believe our inventive electrical solutions
enable safer systems and ensure a more secure world. We design,
manufacture, market, install and service high performance products
and solutions that connect and protect some of the world's most
sensitive equipment, buildings and critical processes. We offer a
comprehensive range of enclosures, electrical connections and
fastening and thermal management solutions across industry-leading
brands that are recognized globally for quality, reliability and
innovation. Our principal office is in London and our management
office is in the United States in Minneapolis. Our robust portfolio
of leading electrical product brands dates back more than 100 years
and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, RAYCHEM and
SCHROFF. Learn more at www.nvent.com.
nVent, CADDY, ERICO, HOFFMAN, ILSCO, RAYCHEM and SCHROFF are
trademarks owned or licensed by nVent Services GmbH or its
affiliates.
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version on businesswire.com: https://www.businesswire.com/news/home/20241118649897/en/
Stacey Wempen Director, External Communications nVent
612-819-6188 Stacey.Wempen@nVent.com
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