ASM EXPANDS ITS EPITAXY PRODUCT OFFERINGS WITH NEW INTREPID® ESA™
07 Luglio 2021 - 5:45PM
ASM EXPANDS ITS EPITAXY PRODUCT OFFERINGS WITH NEW INTREPID® ESA™
Almere, The
NetherlandsJuly 7,
2021,
5.45 p.m. CET
New epitaxy tool addresses 300mm
applications for power, analog and wafer markets
ASM International N.V. (Euronext
Amsterdam: ASM) today introduced its
Intrepid®
ESA™ epitaxy tool for
300mm applications for power and analog devices, and for epitaxial
silicon wafers. Based on the proven, high-volume-manufacturing
Intrepid platform, the new ESA tool expands
ASM’s atmospheric epi offerings
with ASM’s first 300mm
atmospheric cluster tool. The
Intrepid ESA offers best-in-class on-wafer
performance.
An expanding range of semiconductors are needed
for 5G smartphones, internet of things (IoT), edge computing,
automotive, sensors, renewable energy, and much more. ASM’s epitaxy
tools are critical for depositing silicon-based films in diverse,
fast growing applications for analog and power devices, as well as
for silicon wafer manufacturing.
For chipmakers, the metrics that drive product
yield and fab operational cost will be of utmost importance: the
ability to manufacture a wide range of different products; on-wafer
performance metrics, such as within-wafer and wafer-to-wafer
uniformity; and productivity and foot print efficiency.
ASM has responded to this critical customer need
with the introduction of the Intrepid ESA. The Intrepid ESA has
innovative technologies and features that provide unmatched in-film
performance and reactor availability. These include a hot quartz
isothermal reactor for superior temperature uniformity, allowing
for the deposition of films as thick as 85µm without interruption
and reactor clean, a significant throughput and device performance
benefit. Furthermore, ASM has introduced the first 10-port
MFC-based advanced gas injection system, called AEGIS™, providing
flexibility for film thickness profile control.
To further enhance device performance and die
yield, ASM has pioneered real-time closed-loop wafer temperature
control during epi processing allowing for the in-situ measurement
and control of wafer temperature simultaneously in different areas
of the wafer during processing. This first-of-its-kind feature
enables the elimination of thermal gradient induced wafer slip in
high temperature processing, resulting in improved die yield. In
addition, Intrepid ESA can hold up to four reactors on its XP
platform. It is compact in size, has dual gate valves for isolating
each chamber with the XP platform, and has independent gas delivery
systems.
These features enable considerably higher
throughput and thus improved platform efficiency (wafer output per
square meter) which we view as unique strengths of the Intrepid
ESA.
“Innovative process control features such as
AEGIS and closed loop chamber temperature control uniquely position
Intrepid ESA as the best choice for our customers running
applications for power and analog devices, and for wafer
manufacturers,” said Dr. Hichem M’Saad, Executive Vice President
and General Manager of ASM’s Global Products. “ASM strives to
enable customers to scale cost effectively and with greater
yield.”
More than 30 Intrepid ESA reactors, with repeat
orders, are in production at different sites in Asia and the Unites
States.
About ASM International
ASM International NV, headquartered in Almere,
the Netherlands, its subsidiaries and participations design and
manufacture equipment and materials used to produce semiconductor
devices. ASM International, its subsidiaries and participations
provide production solutions for wafer processing (Front-end
segment) as well as for assembly & packaging and surface mount
technology (Back-end segment) through facilities in the United
States, Europe, Japan and Asia. ASM International's common stock
trades on the Euronext Amsterdam Stock Exchange (symbol ASM). For
more information, visit ASMI's website at www.asm.com.
Cautionary Note Regarding Forward-Looking
Statements: All matters discussed in this press release, except for
any historical data, are forward-looking statements.
Forward-looking statements involve risks and uncertainties that
could cause actual results to differ materially from those in the
forward-looking statements. These include, but are not limited to,
economic conditions and trends in the semiconductor industry
generally and the timing of the industry cycles specifically,
currency fluctuations, corporate transactions, financing and
liquidity matters, the success of restructurings, the timing of
significant orders, market acceptance of new products, competitive
factors, litigation involving intellectual property, shareholders
or other issues, commercial and economic disruption due to natural
disasters, terrorist activity, armed conflict or political
instability, changes in import/export regulations, epidemics and
other risks indicated in the Company's reports and financial
statements. The Company assumes no obligation nor intends to update
or revise any forward-looking statements to reflect future
developments or circumstances.
This press release contains inside information
within the meaning of Article 7(1) of the EU Market Abuse
Regulation.
CONTACT
Investor and
media contact:Victor
BareñoT: +31 88 100 8500 E: victor.bareno@asm.com
- 20210707 ASM Expands Its Epitaxy Product Offerings With New
Intrepid® ESA™
Grafico Azioni ASM International NV (EU:ASM)
Storico
Da Mar 2024 a Apr 2024
Grafico Azioni ASM International NV (EU:ASM)
Storico
Da Apr 2023 a Apr 2024