29 April
2024
Sondrel (Holdings) plc
("Sondrel", the
"Company" and together with its subsidiaries the
"Group")
Successful Milestone
Completion
Tapeout of turnkey ASIC
engagement with a Tier 1 OEM Automotive customer
Sondrel (AIM: SND), a leading provider of ultra-complex chips for leading global
technology brands, is pleased to announce that it has successfully
completed the tapeout, the next key milestone, including
the associated invoicing, in respect of the
material turnkey ASIC engagement for a Tier 1 OEM Automotive
customer (the "Project").
Tapeout signals the completion of
the design phase of an ASIC and the handover of all data to the
silicon foundry which is contracted to manufacture the ASIC. This
tapeout data is used to initiate the generation of photomasks by
the foundry, which are then used to produce prototype silicon
wafers. These wafers are then packaged and tested before delivery
to the customer for prototype assessment.
With the design phase of the Project
now achieved and its tapeout completed, the Company will progress
with the new product introduction and prototyping phases of the
turnkey supply services being provided to the customer.
David
Mitchard, Interim Chief Executive Officer of Sondrel,
commented:
"The
successful completion of this milestone demonstrates our commitment
to our customer, and the close collaboration between the
teams.
"Since the beginning of the year we have made
good progress on this important ASIC project with the automotive
Tier 1 supplier. I would like to thank Sondrel's employees,
suppliers and customers for their continued support over recent
months.
''Our focus on end markets that are aligned with strong and
enduring global technology megatrends means that we have a good
pipeline of design opportunities for 2024."
For further information:
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Sondrel (Holdings) plc
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Via
Buchanan
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David Mitchard, Interim
CEO
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Tel: +44
(0) 20 7466 5000
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Nick Stone, Interim CFO
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Cavendish Capital Markets Limited
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Tel: +44
(0) 20 7220 0500
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Ben Jeynes / Katy Birkin / George
Lawson - Corporate Finance
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Michael Johnson / Charlie Combe -
Sales and ECM
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Buchanan Communications
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Tel: +44
(0) 20 7466 5000
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Chris Lane
Stephanie Whitmore
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sondrel@buchanan.uk.com
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Jack Devoy
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Abby Gilchrist
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About Sondrel
Sondrel is a UK-based fabless
semiconductor company specialising in high end, complex digital
Application Specific Integrated Circuits (ASICs) and System on
Chips (SOCs). It provides a full turnkey service in the design,
prototyping, testing, packaging and production of ASICs and
SoCs.
The Company is one of only a few
companies capable of designing and supplying the higher-spec chips
built on the most advanced semiconductor technologies, selling into
a range of hyper growth end markets such as high-performance
computing, automotive, artificial intelligence, VR/AR, video
analytics, image processing, mobile networking and data
centres. Sondrel designs have enabled products by leading
technology brands including Apple (iPhone), Sony (PlayStation),
Meta's (Oculus), Samsung, Google and Sony smartphones, JVC
(prosumer camcorders), Tesla and Mercedes-Benz cars.
Sondrel is well-established, with a
20-year track record of successful delivery, supported by long
standing ecosystem partnerships including Arm, TSMC and Samsung.
Headquartered in the UK, Sondrel has a global presence with offices
in UK, USA, China, India and Morocco.
For more information please
visit: ir.sondrel.com.