Intel announces expanded process roadmap,
customers and ecosystem partners to deliver on ambition to be the
No. 2 foundry by 2030.
Company hosts Intel Foundry event featuring
U.S. Commerce Secretary Gina Raimondo, Arm CEO Rene Haas and Open
AI CEO Sam Altman and others.
NEWS HIGHLIGHTS
- Intel Foundry launches as the world’s first systems foundry for
the AI era, delivering leadership in technology, resiliency and
sustainability.
- Intel Foundry unveils new roadmap featuring Intel 14A process
technology, specialized node evolutions and new Intel Foundry
Advanced System Assembly and Test (ASAT) capabilities to help
customers realize their AI ambitions.
- Intel Foundry announces design win: Microsoft CEO Satya Nadella
shares that Microsoft has chosen a chip design it plans to produce
on the Intel 18A process.
- Ecosystem partners including Synopsys, Cadence, Siemens and
Ansys announce validated tools, design flows and intellectual
property (IP) portfolios ready to enable customer designs.
Intel Corp. (INTC) today launched Intel Foundry as a more
sustainable systems foundry business designed for the AI era and
announced an expanded process roadmap designed to establish
leadership into the latter part of this decade. The company also
highlighted customer momentum and support from ecosystem partners –
including Synopsys, Cadence, Siemens and Ansys – who outlined their
readiness to accelerate Intel Foundry customers’ chip designs with
tools, design flows and IP portfolios validated for Intel’s
advanced packaging and Intel 18A process technologies.
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Announced at Intel Foundry Direct
Connect, Intel’s extended process technology roadmap adds Intel 14A
to the company’s leading-edge node plan, in addition to several
specialized node evolutions and new Intel Foundry Advanced System
Assembly and Test capabilities. Intel also affirmed that its
ambitious five-nodes-in-four-years process roadmap remains on track
and will deliver the industry’s first backside power solution.
(Credit: Intel Corporation)
The announcements were made at Intel’s first foundry event,
Intel Foundry Direct Connect, where the company gathered customers,
ecosystem companies and leaders from across the industry. Among the
participants and speakers were U.S. Secretary of Commerce Gina
Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI
CEO Sam Altman and others.
More: Intel Foundry Direct Connect (Press Kit)
“AI is profoundly transforming the world and how we think about
technology and the silicon that powers it,” said Intel CEO Pat
Gelsinger. “This is creating an unprecedented opportunity for the
world’s most innovative chip designers and for Intel Foundry, the
world’s first systems foundry for the AI era. Together, we can
create new markets and revolutionize how the world uses technology
to improve people’s lives.”
Process Roadmap Expands Beyond 5N4Y
Intel’s extended process technology roadmap adds Intel 14A to
the company’s leading-edge node plan, in addition to several
specialized node evolutions. Intel also affirmed that its ambitious
five-nodes-in-four-years (5N4Y) process roadmap remains on track
and will deliver the industry’s first backside power solution.
Company leaders expect Intel will regain process leadership with
Intel 18A in 2025.
The new roadmap includes evolutions for Intel 3, Intel 18A and
Intel 14A process technologies. It includes Intel 3-T, which is
optimized with through-silicon vias for 3D advanced packaging
designs and will soon reach manufacturing readiness. Also
highlighted are mature process nodes, including new 12 nanometer
nodes expected through the joint development with UMC announced
last month. These evolutions are designed to enable customers to
develop and deliver products tailored to their specific needs.
Intel Foundry plans a new node every two years and node evolutions
along the way, giving customers a path to continuously evolve their
offerings on Intel’s leading process technology.
Intel also announced the addition of Intel Foundry FCBGA 2D+ to
its comprehensive suite of ASAT offerings, which already include
FCBGA 2D, EMIB, Foveros and Foveros Direct.
Microsoft Design on Intel 18A Headlines Customer
Momentum
Customers are supporting Intel’s long-term systems foundry
approach. During Pat Gelsinger’s keynote, Microsoft Chairman and
CEO Satya Nadella stated that Microsoft has chosen a chip design it
plans to produce on the Intel 18A process.
“We are in the midst of a very exciting platform shift that will
fundamentally transform productivity for every individual
organization and the entire industry,” Nadella said. “To achieve
this vision, we need a reliable supply of the most advanced,
high-performance and high-quality semiconductors. That’s why we are
so excited to work with Intel Foundry, and why we have chosen a
chip design that we plan to produce on Intel 18A process.”
Intel Foundry has design wins across foundry process
generations, including Intel 18A, Intel 16 and Intel 3, along with
significant customer volume on Intel Foundry ASAT capabilities,
including advanced packaging.
In total, across wafer and advanced packaging, Intel Foundry’s
expected lifetime deal value is greater than $15 billion.
IP and EDA Vendors Declare Readiness for Intel Process and
Packaging Designs
Intellectual property and electronic design automation (EDA)
partners Synopsys, Cadence, Siemens, Ansys, Lorentz and Keysight
disclosed tool qualification and IP readiness to enable foundry
customers to accelerate advanced chip designs on Intel 18A, which
offers the foundry industry’s first backside power solution. These
companies also affirmed EDA and IP enablement across Intel node
families.
At the same time, several vendors announced plans to collaborate
on assembly technology and design flows for Intel’s embedded
multi-die interconnect bridge (EMIB) 2.5D packaging technology.
These EDA solutions will ensure faster development and delivery of
advanced packaging solutions for foundry customers.
Intel also unveiled an "Emerging Business Initiative" that
showcases a collaboration with Arm to provide cutting-edge foundry
services for Arm-based system-on-chips (SoCs). This initiative
presents an important opportunity for Arm and Intel to support
startups in developing Arm-based technology and offering essential
IP, manufacturing support and financial assistance to foster
innovation and growth.
Systems Approach Differentiates Intel Foundry in the AI
Era
Intel’s systems foundry approach offers full-stack optimization
from the factory network to software. Intel and its ecosystem
empower customers to innovate across the entire system through
continuous technology improvements, reference designs and new
standards.
Stuart Pann, senior vice president of Intel Foundry at Intel
said, “We are offering a world-class foundry, delivered from a
resilient, more sustainable and secure source of supply, and
complemented by unparalleled systems of chips capabilities.
Bringing these strengths together gives customers everything they
need to engineer and deliver solutions for the most demanding
applications.”
Global, Resilient, More Sustainable and Trusted Systems
Foundry
Resilient supply chains must also be increasingly sustainable,
and today Intel shared its goal of becoming the industry’s most
sustainable foundry. In 2023, preliminary estimates show that Intel
used 99% renewable electricity in its factories worldwide. Today,
the company redoubled its commitment to achieving 100% renewable
electricity worldwide, net-positive water and zero waste to
landfills by 2030. Intel also reinforced its commitment to net-zero
Scope 1 and Scope 2 GHG emissions by 2040 and net-zero upstream
Scope 3 emissions by 2050.
Forward-Looking Statements
This release contains forward-looking statements, including with
respect to Intel’s:
- business plans and strategy;
- current and future technologies, including future process nodes
and transistor, manufacturing, and packaging technologies;
- process and product roadmaps and schedules (including expected
goals, timelines, ramps, progress, availability, and
production);
- future product architectures;
- expectations regarding process performance, PPA gains, and
other performance metrics;
- expectations regarding product and process leadership;
- plans and goals with respect to our foundry business, including
with respect to anticipated customers, expected lifetime deal
value, future manufacturing capacity, service, technology and IP
offerings, third-party collaborations, ecosystem support and
resilience;
- AI strategy and capabilities;
- future social and environmental performance goals, measures,
strategies, and results;
- anticipated growth, future market share, and trends in our
businesses and operations;
- projected growth and trends in markets relevant to our
businesses; and
- other characterizations of future events or circumstances.
Such statements involve many risks and uncertainties that could
cause our actual results to differ materially from those expressed
or implied, including those associated with:
- the high level of competition and rapid technological change in
our industry;
- the significant long-term and inherently risky investments we
are making in R&D and manufacturing facilities that may not
realize a favorable return;
- the complexities and uncertainties in developing and
implementing new semiconductor products and manufacturing process
technologies;
- our ability to time and scale our capital investments
appropriately and successfully secure favorable alternative
financing arrangements and government grants;
- implementing new business strategies and investing in new
businesses and technologies;
- changes in demand for our products;
- macroeconomic conditions and geopolitical tensions and
conflicts, including geopolitical and trade tensions between the
U.S. and China, the impacts of Russia's war on Ukraine, tensions
and conflict affecting Israel, and rising tensions between mainland
China and Taiwan;
- the evolving market for products with AI capabilities;
- our complex global supply chain, including from disruptions,
delays, trade tensions and conflicts, or shortages;
- product defects, errata, and other product issues, particularly
as we develop next-generation products and implement
next-generation manufacturing process technologies;
- potential security vulnerabilities in our products; increasing
and evolving cybersecurity threats and privacy risks;
- IP risks including related litigation and regulatory
proceedings;
- the need to attract, retain, and motivate key talent;
- strategic transactions and investments;
- sales-related risks, including customer concentration and the
use of distributors and other third parties;
- our significantly reduced return of capital in recent
years;
- our debt obligations and our ability to access sources of
capital;
- complex and evolving laws and regulations across many
jurisdictions;
- fluctuations in currency exchange rates;
- changes in our effective tax rate;
- catastrophic events;
- environmental, health, safety, and product regulations;
- our initiatives and new legal requirements with respect to
corporate responsibility matters; and
- other risks and uncertainties described in this release, our
most recent Annual Report on Form 10-K and our other filings with
the U.S. Securities and Exchange Commission (SEC).
All information in this press release reflects Intel management
views as of the date hereof unless an earlier date is specified.
Intel does not undertake, and expressly disclaims any duty, to
update such statements, whether as a result of new information, new
developments, or otherwise, except to the extent that disclosure
may be required by law.
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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John Hipsher 1-669-223-2416 john.hipsher@intel.com
Robin Holt 1-503-616-1532 robin.holt@intel.com
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