GBT is researching the Development
of Electro-Thermal Aware Design Environment for Integrated
Circuits.
Seeking to Address Advanced
Nanometer Nodes Semiconductors Electro-Thermal Modeling and
Optimization.
SAN DIEGO, CA --
September 29,th 2022 --
InvestorsHub NewsWire -- GBT Technologies Inc. (OTC
PINK: GTCHD )
("GBT" or the "Company") is researching to develop Electro-Thermal
Aware design environment electronic design automation (EDA)
technology for integrated circuits (IC). Increasing power
densities, cost and an associated greater utilization of advanced
nodes semiconductors are making electro-thermal analysis and
simulation a crucial reliability aspect. The ever-growing packing
density and power consumption factors are significantly affecting
IC's design's electro-thermal behavior. The increasing variability
of processes parameters, particularly in advanced nanometer
technologies has resulted in a larger impact of the substrate and
metal line temperatures and on the reliability and performance of
the devices. Research data shows that more than 50% of all IC
failures are related to thermal issues. GBT is researching to
develop an Electro-Thermal Aware design environment for integrated
circuits with the goal of addressing thermal impact early during
the design stages. The design environment is planned to perform a
microchip's Electro-Thermal analysis to detect hot areas in the
physical layout. The analysis is planned to be running in the
background as the engineers are designing the IC's circuits and
layout. The goal is to create the IC's thermal map on-the-fly and
alerting designers for possible hot-spots that should be eliminated
to keep the chip's optimal temperature. The interactive analysis
will be responding to the chip's circuit's power variations in
real-time, with the goal of accurately predicting the die
temperature including neighboring device effect. The goal of the
system will be to generate thermal maps interactively pointing to
heated zones that may cause performance issues or lead to chip's
failure. The system will simulate the IC's during peak power
consumptions to identify critical area that may overheat. High
operating temperature of a microchip will significantly lower its
reliability and performance. It is the goal of an Electro-Thermal
Aware Design environment to keep the chip's die at the optimal
operating temperature during operation, ensuring high performance,
superior reliability, optimized power management and long life.
"It
is GBT's goal to determine the feasibility of an Electro-Thermal
Aware Design environment for integrated circuits that can be
implemented early in the design stage and therefore create Thermal
Friendly design at the point of construction. It
is expected that the system will start with Library Cells design,
which are the basic layout blocks. The goal of the software is to
achieve block level, homogenous thermal dissipation and, therefore,
less current consumption and better performance.
As today's
electronic designs are constantly driven by the demand to reduce in
size and provide faster performance, ultimately they translate into
high power densities, higher operating temperatures and reduced
reliability. Furthermore, local hot spots, which have much higher
temperatures compared to the average die temperature, are becoming
more common in advanced nodes and power circuits. Elevated
temperatures are a major contributor in lowering the IC's
performance and reliability. We believe an efficient IC's thermal
design could directly impact the overall system performance and
reliability. We are already addressing reliability with our Epsilon
EDA technology and now expanding into the Electro-Thermal domain
since it is a crucial reliability factor. We believe finding an
optimized solution, early during the IC's design stage, is the most
efficient solution to keep the IC's operating temperatures in the
optimal zone for best performance and superior reliability. A
microchip's electro-thermal map should be "green" only and our
technology will eliminate the "red" and "orange" zones. Given the
immense size of modern chips, we plan to utilize our machine
learning technology in our research. Reliable thermal assessments
require a combination of efficient analytical calculations using
thermal specifications, empirical analysis and thermal modeling. We
believe that the key for efficient Electro-Thermal behavior is an
early analysis and correction to ensure high performance, low power
consumption and long life of integrated circuits projects." stated
Danny Rittman, the Company's CTO.
The Company
released a video presenting this press release that can be viewed
at: https://youtu.be/uGXfEvGGTj4
There
is no guarantee that the Company will be successful in researching,
developing or implementing this system. In order to
successfully implement this concept, the Company will need to raise
adequate capital to support its research and, if successfully
researched and fully developed, the Company would need to enter
into a strategic relationship with a third party that has
experience in manufacturing, selling and distributing this
product. There is no guarantee that the Company will be
successful in any or all of these critical steps.
About Us
GBT
Technologies, Inc. (OTC PINK: GTCHD) ("GBT") (http://gbtti.com)
is a development stage company which considers itself a native of
Internet of Things (IoT), Artificial Intelligence (AI) and Enabled
Mobile Technology Platforms used to increase IC performance. GBT
has assembled a team with extensive technology expertise and is
building an intellectual property portfolio consisting of many
patents. GBT's mission, to license the technology and IP to
synergetic partners in the areas of hardware and software. Once
commercialized, it is GBT's goal to have a suite of products
including smart microchips, AI, encryption, Blockchain, IC design,
mobile security applications, database management protocols, with
tracking and supporting cloud software (without the need for GPS).
GBT envisions this system as a creation of a global mesh network
using advanced nodes and super performing new generation IC
technology. The core of the system will be its advanced microchip
technology; technology that can be installed in any mobile or fixed
device worldwide. GBT's vision is to produce this system as a low
cost, secure, private-mesh-network between all enabled devices.
Thus, providing shared processing, advanced mobile database
management and sharing while using these enhanced mobile features
as an alternative to traditional carrier services.
Forward-Looking Statements
Certain
statements contained in this press release may constitute
"forward-looking statements". Forward-looking statements
provide current expectations of future events based on certain
assumptions and include any statement that does not directly relate
to any historical or current fact. Actual results may differ
materially from those indicated by such forward-looking statements
because of various important factors as disclosed in our filings
with the Securities and Exchange Commission located at their
website ( http://www.sec.gov).
In addition to these factors, actual future performance, outcomes,
and results may differ materially because of more general factors
including (without limitation) general industry and market
conditions and growth rates, economic conditions, governmental and
public policy changes, the Company's ability to raise capital on
acceptable terms, if at all, the Company's successful development
of its products and the integration into its existing products and
the commercial acceptance of the Company's products. The
forward-looking statements included in this press release represent
the Company's views as of the date of this press release and these
views could change. However, while the Company may elect to
update these forward-looking statements at some point in the
future, the Company specifically disclaims any obligation to do
so. These forward-looking statements should not be relied
upon as representing the Company's views as of any date subsequent
to the date of the press release.
Contact:
Dr. Danny Rittman,
CTO
press@gopherprotocol.com
