Aviza Technology Introduces Versalis fxP
16 Giugno 2008 - 12:30PM
Business Wire
Aviza Technology, Inc. (NASDAQ:AVZA), a supplier of advanced
semiconductor capital equipment and process technologies for the
global semiconductor industry and related markets, today announced
the introduction of the Versalis fxP, a 200/300 mm cluster system
targeted for 3D-IC manufacturing using through silicon via (TSV)
technology. Aviza is at the forefront of developing this unique
integrated process solution for research and development (R&D)
that encompasses multiple steps, including Etch, PVD and CVD, in
order to deliver functional 3D-IC packages and accelerate
time-to-market for such products. The Versalis fxP is based on
Aviza�s production-proven single-wafer platform, which can
incorporate up to six process modules. Its individual modules such
as deep silicon etch, PVD and CVD have all been proven in
high-volume manufacturing for various applications including wafer
level packaging, MEMS and power semiconductors. The Versalis fxP
platform combines all of the critical processes needed to create a
via ready for plating. This �one-stop shop� solution enables
customers to invest less capital for R&D, minimizing
installation costs and optimizing use of their fab area. �By
leveraging Aviza�s process expertise in the areas of etch, PVD and
CVD, the company has introduced an innovative system, the Versalis
fxP, which offers a unique integrated processing solution to the
R&D community focusing on 3D-ICs using TSV technology,� said
Kevin Crofton, Vice President and General Manager, PVD/CVD/Etch
Business Unit of Aviza Technology, Inc. �Customers will benefit
from Aviza�s process expertise in these three process areas in
order to meet our customers� manufacturing requirements for
next-generation 3D architectures. On one platform, customers can
develop their TSV processes in a cost-effective and efficient
manner with the ability to seamlessly migrate them to the
production environment.� TSV Approach Three key elements are
driving the design of advanced consumer products, increased
functionality, reduced size and lower cost. These are the very same
drivers that are pushing the adoption of 3D-ICs and the associated
required packaging technologies. The two most common technologies
for 3D-IC packaging are wire bonding and TSV to establish the
electrical connectivity between the components of the stacked die.
An increasingly important factor in favor of TSV is that it can
consume up to 30 percent less Silicon than the wire-bonded
equivalent, because wire bonding can only connect around the
periphery of the device. Recently, the raw cost of Silicon has
risen over 10x fueled by solar cell demand, significantly changing
the cost comparison picture between TSV and wire bonding. Further,
this requirement for additional Silicon to satisfy wire-bonders
means that less die can be manufactured on the source wafer,
putting additional pressure on profit margins. In addition, TSV is
gaining wider adoption by 3D-IC manufacturers, as this approach has
demonstrated the ability to keep the interconnect distance very
short and removes any real limitation on the number of die that can
be stacked in this manner. As a result, TSVs can enable smaller
form factor devices and has demonstrated improved device speed and
functionality. 3D-ICs using TSV technology have numerous
applications, including NAND Flash Memory, Image Sensors, Sensors
and DSP, DRAM, SRAM, FPGA and Memory, Processors, Amplifiers for
Wireless LAN, Communication for Mobile Phones and Military
applications. Leading market research firm Yole D�veloppment
forecasts the compounded annual growth rate (CAGR) for 3D-IC wafers
to be above 60 percent by 2012. �The 3D-IC arena is clearly a
growth market with increased activity on numerous fronts,� said
J�r�me Baron, Market Analyst at Yole D�veloppment. �TSV processes
have shown significant device and performance benefits over other
methods. An integrated process approach for TSV will play a
critical role in streamlining the development process.� Unique
Integrated Processing Capabilities For R&D and pilot
production, the ideal system solution would be a single toolset
capable of four critical, individual process steps in TSV
formation: TSV etch, CVD liner & liner etch and PVD. The unique
advantage of such an approach enables dramatically shortened TSV
development time. With all three process technologies (etch, PVD
and CVD) on board, the Versalis fxP offers much smaller footprint,
compared to three individual systems, and a single install
minimizing cost and disruption to the cleanroom, thus reducing the
overall development and processing time to deliver the first wafer
out. In addition, this type of system allows R&D users to link
separate processes without breaking vacuum to discover potential
performance benefits, and then apply those findings to optimally
configure production systems�which would not be possible on
traditionally configured single-process systems. For full volume
production capability, the individual process modules would be
installed onto additional handlers, each one dedicated to each of
the separate processes�a feature offered by the Versalis fxP
system. This approach can only be realized if the process modules
all shared common mechanical interface and control systems. This
leads to minimal process re-qualification, an additional advantage
for adopting an integrated hardware and process approach for
TSV-based 3D packaging. Safe Harbor This press release contains
forward-looking statements. These forward-looking statements are
based on our management's current expectations and beliefs and
involve numerous risks and uncertainties that could cause actual
results to differ materially from expectations. You should not rely
upon these forward-looking statements as predictions of future
events because we cannot assure you that the events or
circumstances reflected in these statements will be achieved or
will occur. These forward-looking statements include, but are not
limited to, the statements made by Kevin Crofton and all statements
containing the words "believes," "expects," "may," "will,"
"should," "seeks," "intends," "plans," "estimates" or "anticipates"
or the negative of these words and phrases or other variations of
these words and phrases or comparable terminology. Many factors
could cause our actual results to differ materially from those
projected in these forward-looking statements. Some of these
factors and other important factors are detailed in our various
Securities and Exchange Commission filings, particularly in our
most recent Annual Report on Form 10-K and Quarterly Report on Form
10-Q, copies of which are available from us without charge. Please
review these filings and do not place undue reliance on these
forward-looking statements. We assume no obligation to update
forward-looking statements. About Aviza Technology, Inc. Aviza
Technology, Inc. designs, manufactures, sells and supports advanced
semiconductor capital equipment and process technologies for the
global semiconductor industry and related markets. The company�s
systems are used in a variety of segments of the semiconductor
market, such as advanced silicon for memory devices, advanced 3-D
packaging and power integrated circuits for communications. Aviza�s
common stock is publicly traded on the NASDAQ Global Market (NASDAQ
GM: AVZA). Aviza is headquartered in Scotts Valley, Calif., with
manufacturing, R&D, sales and customer support facilities
located in the United Kingdom, Germany, France, Taiwan, China,
Japan, Korea, Singapore and Malaysia. Additional information about
the company can be found at http://www.aviza.com.
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