News highlights:
- 100V GaN power stages with thermally enhanced package
technology reduce solution size by over 40% and increase power
efficiency with 50% lower switching losses.
- The industry's smallest 1.5W isolated DC/DC modules deliver
over eight times higher power density for automotive and industrial
applications.
DALLAS, Feb. 20,
2024 /PRNewswire/ -- Texas Instruments (TI)
(Nasdaq: TXN) today introduced two new power conversion device
portfolios to help engineers achieve more power in smaller spaces,
providing the highest power density at a lower cost. TI's new 100V
integrated gallium nitride (GaN) power stages feature thermally
enhanced dual-side cooled package technology to simplify thermal
designs and achieve the highest power density in mid-voltage
applications at more than 1.5kW/in3. TI's new 1.5W
isolated DC/DC modules with integrated transformers are the
industry's smallest and most power-dense, helping engineers shrink
the isolated bias power-supply size in automotive and industrial
systems by over 89%. Devices from both portfolios will be on
display at this year's Applied Power Electronics Conference (APEC),
Feb. 25-29 in Long Beach, California.
For more information, see TI.com/LMG2100 and
TI.com/UCC33420-Q1.
"For power-supply designers, delivering more power in limited
spaces will always be a critical design challenge," said
Kannan Soundarapandian, general
manager of High Voltage Power at TI. "Take data centers, for
example – if engineers can design power-dense server power-supply
solutions, data centers can operate more efficiently to meet
growing processing needs while also minimizing their environmental
footprint. We're excited to continue to push the limits of power
management by offering innovations that help engineers deliver the
highest power density, efficiency and thermal performance."
Increase power density and efficiency with 100V integrated
GaN power stages
With TI's new 100V GaN power stages,
LMG2100R044 and LMG3100R017, designers can reduce power-supply
solution size for mid-voltage applications by more than 40% and
achieve industry-leading power density of over
1.5kW/in3, enabled by GaN technology's higher switching
frequencies. The new portfolio also reduces switching power losses
by 50% compared to silicon-based solutions, while achieving 98% or
higher system efficiency given the lower output capacitance and
lower gate-drive losses. In a solar inverter system, for
example, higher density and efficiency enables the same panel to
store and produce more power while decreasing the size of the
overall microinverter system.
A key enabler of the thermal performance in the 100V GaN
portfolio is TI's thermally enhanced dual-side cooled package. This
technology enables more efficient heat removal from both sides of
the device and offers improved thermal resistance compared to
competing integrated GaN devices.
To learn more about the benefits of TI's 100V GaN power stages
for mid-voltage applications, read the technical article, "4
mid-voltage applications where GaN will transform electronic
designs."
Shrink bias power supplies by more than 89%
With over
eight times higher power density than discrete solutions and three
times higher power density than competing modules, TI's new 1.5W
isolated DC/DC modules deliver the highest output power and
isolation capability (3kV) for automotive and industrial systems in
a 4mm-by-5mm very thin small outline no-lead (VSON) package. With
TI's UCC33420-Q1 and UCC33420, designers can also easily meet
stringent electromagnetic interference (EMI) requirements, such as
Comité International Spécial des Perturbations Radioélectriques
(CISPR) 32 and 25, with fewer components and a simple filter
design.
The new modules use TI's next-generation integrated transformer
technology, which eliminates the need for an external transformer
in a bias supply design. The technology allows engineers to shrink
solution size by more than 89% and reduce height by up to 75%,
while cutting bill of materials by half compared to discrete
solutions.
With the first automotive-qualified solution in this small
package, designers can now reduce the footprint, weight and height
of their bias supply solution for electric vehicle systems such as
battery management systems. For space-constrained industrial power
delivery in data centers, the new module enables designers to
minimize printed circuit board area.
To learn more about the benefits of TI's 1.5W isolated DC/DC
modules, read the technical article, "How a new isolated DC/DC
module can help solve power-density challenges."
Pushing the limits of power at APEC 2024
These new
devices are the latest ways TI is pushing power further and making
innovation possible for engineers everywhere. At APEC 2024, TI will
showcase the latest automotive and industrial designs for 48V
automotive power; the first USB Power Delivery Extended Power Range
full charging solution on the market; an 800V, 300kW silicon
carbide-based traction inverter; high-efficiency power for server
motherboards; and more.
- Saturday, Feb. 24-Thursday, Feb.
29: Visit TI in the Long Beach Convention &
Entertainment Center, Booth No. 1145. See TI.com/APEC for more
information.
- Wednesday, Feb. 28 at
12 p.m. Pacific time: TI
General Manager of Industrial Power Design Services Robert Taylor
will present an industry session, "To Power Density and Beyond:
Breaking Through Barriers to Achieve the Highest Power Density." He
will discuss innovations in packaging, integration and system-level
techniques that are making greater power density possible.
- Throughout APEC: TI power experts will lead 20 industry
and technical sessions to address power-management design
challenges. The full schedule of TI experts' industry and technical
sessions is available at TI.com/APEC.
Available today on TI.com
- Production quantities of the LMG2100R044 and LMG3100R017 100V
GaN power stages are available for purchase now on TI.com.
- Preproduction quantities of the UCC33420 and UCC33420-Q1 1.5W
isolated DC/DC modules are available for purchase now on TI.com.
Other versions of these devices with lower input voltages, output
voltages and power ratings are expected to be available in second
quarter of 2024.
- Multiple payment and shipping options are available.
About Texas Instruments
Texas Instruments Incorporated
(Nasdaq: TXN) is a global semiconductor company that designs,
manufactures, tests and sells analog and embedded processing chips
for markets such as industrial, automotive, personal electronics,
communications equipment and enterprise systems. Our passion to
create a better world by making electronics more affordable through
semiconductors is alive today, as each generation of innovation
builds upon the last to make our technology smaller, more
efficient, more reliable and more affordable – making it possible
for semiconductors to go into electronics everywhere. We think of
this as Engineering Progress. It's what we do and have been doing
for decades. Learn more at TI.com.
Trademarks
All registered trademarks and other
trademarks belong to their respective owners.
View original content to download
multimedia:https://www.prnewswire.com/news-releases/new-portfolios-from-ti-push-the-limits-of-power-design-further-help-engineers-achieve-industry-leading-power-density-302064509.html
SOURCE Texas Instruments